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          DS-1102強(qiáng)固型嵌入式電腦
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          強(qiáng)固型嵌入式電腦

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          產(chǎn)品簡(jiǎn)介
          DS-1102第7/6代Intel® Core™ i3 / i5 / i7 處理器, 高性能,擴(kuò)展型和模塊化的強(qiáng)固型嵌入式系統(tǒng),帶2個(gè)PCI/PCIe 擴(kuò)展槽產(chǎn)品特點(diǎn)支持第7/6代Intel® Xeon®和Core™ i3 / i5 / i7 處理器(LGA1151) 2個(gè)DDR4 SO-DIMM 內(nèi)存插槽,支持2133MHz 64 GB 三重獨(dú)立顯示 (1個(gè)DVI-I, 2個(gè)DP) 1個(gè)2.5......
          產(chǎn)品介紹
          德承DS-1102是一款高性能的無(wú)風(fēng)扇嵌入式計(jì)算機(jī),采用7/6代Intel®Core™平臺(tái),支持多種臺(tái)式機(jī)CPU(LGA1151) ,支持兩個(gè)DDR4內(nèi)存插槽,可達(dá)64GB,使DS-1102能夠滿足各種計(jì)算需求。DS-1102具有豐富的I/O接口、串口供電、電隔離串口、光隔離數(shù)字I/O、多網(wǎng)口、網(wǎng)口供電(POE)、M12接口、RAID 0/1、智能點(diǎn)火控制和0.2秒即時(shí)重啟等功能。

          由于德承的CMI和CFM技術(shù),您可根據(jù)具體需要使用我們現(xiàn)成的模塊配置專屬的DS-1102。此外,還支持2個(gè)PCI/PCIe擴(kuò)展槽,具有不同的接口組合,用于擴(kuò)展各種應(yīng)用的擴(kuò)展卡。DS-1102是一款堅(jiān)固耐用的嵌入式系統(tǒng),具有寬工作溫度(-40°C ~ 70°C),寬壓直流電源輸入(9V ~ 48V),防震抗沖擊能力強(qiáng)(5G/50G),高標(biāo)準(zhǔn)的工業(yè)保護(hù),具有超級(jí)電容可免維護(hù)長(zhǎng)效運(yùn)行等特點(diǎn)。DS-1102適用于惡劣環(huán)境和關(guān)鍵應(yīng)用場(chǎng)合的部署,無(wú)需現(xiàn)場(chǎng)人員的維護(hù)。
          詳細(xì)規(guī)格
          Model NameDS-1102
          SystemProcessor? 7th Generation Intel® CPU (Kaby Lake-S)
          - Intel® Core™ i7-7700T Processor (8M Cache, up to 3.8 GHz, 35W TDP)
          - Intel® Core™ i5-7500T Processor (6M Cache, up to 3.30 GHz, 35W TDP)
          - Intel® Core™ i3-7101TE Processor (3M Cache, 3.40 GHz, 35W TDP)
          - Intel® Celeron® G3930TE Processor (2M Cache, 2.70 GHz, 35W TDP)
          - Intel® Core™ i7-7700 Processor (8M Cache, up to 4.20 GHz, 65W TDP)
          - Intel® Core™ i5-7500 Processor (6M Cache, up to 3.80 GHz, 65W TDP)
          - Intel® Celeron® G3930E Processor (2M Cache, 2.90 GHz, 54W TDP)
          ? 6th Generation Intel® CPU (Skylake-S)
          - Intel® Core™ i7-6700TE Processor (8M Cache, up to 3.40 GHz, 35W TDP)
          - Intel® Core™ i5-6500TE Processor (6M Cache, up to 3.30 GHz, 35W TDP)
          - Intel® Core™ i3-6100TE Processor (4M Cache, 2.70 GHz, 35W TDP)
          - Intel® Pentium® Processor G4400TE (3M Cache, 2.40 GHz, 35W TDP)
          - Intel® Celeron® Processor G3900TE (2M Cache, 2.30 GHz, 35W TDP)
          - Intel® Core™ i7-6700 Processor (8M Cache, up to 4.00 GHz, 65W TDP)
          - Intel® Core™ i5-6500 Processor (6M Cache, up to 3.60 GHz, 65W TDP)
          - Intel® Core™ i3-6100 Processor (3M Cache, 3.70 GHz, 51W TDP)
          - Intel® Pentium® Processor G4400 (3M Cache, 3.30 GHz, 54W TDP)
          - Intel® Celeron® Processor G3900 (2M Cache, 2.80 GHz, 51W TDP)
          ChipsetIntel Q170
          Memory2x DDR4 2133 MHz SO-DIMM, Up to 64 GB (Un-buffered and Non-ECC)
          Graphics.Integrated Intel® HD Graphics
          .Three Independent Display
          AudioRealtek ALC888-GR, High Definition Audio
          BIOSAMI 16 Mbit SPI BIOS
          I/O InterfaceDVI1x DVI-I connector, Up to 1920x1080@60Hz
          DP2x DP connector, Up to 3840 x 2160
          LAN
          2x 10/100/1000 Mbps, RJ45
          GbE1: Intel I219-LM
          GbE2: Intel I210
          Support Wake On Lan, Teaming, Jumbo frame, IEEE 1588v2, PXE
          Optional Module
          .4x 10/100/1000 Mbps, RJ45 Port
          .4x 10/100/1000 Mbps, M12 Port
          PoE+Optional Module
          .4x PoE+, Individual port 25.5W, RJ45 Port
          .4x PoE+, Individual port 25.5W, M12 Port
          Serial Port2x RS-232/422/485 with Auto Flow Control Support 5V/12V, DB9
          Optional Module
          .4x RS-232/422/485, DB9 Connector
          .4x Electrical Isolated RS-232/422/485, DB9 Connector
          USB.6x USB 3.0, Type-A
          .2x USB 2.0, Type-A
          PS/2 Port1x PS/2, 6-pin mini-DIN Female Connector
          Isolated DIOOptional Module
          .8x Optical Isolated DIO(4DI, 4DO), 10 pin Terminal Block
          Line-Out1x Line-Out, Phone Jack 3.5mm
          Mic-In1x Mic-In, Phone Jack 3.5mm
          Power Button1x ATX Power On/Off Button
          AT/ATX Switch1x AT/ATX Mode Switch
          Clear CMOS Switch1x Clear CMOS Switch
          Remote Power On/Off Connector1x Remote Power On/Off Connector, 2-pin Terminal Block
          Remote Reset Connector1x Remote Reset Connector, 2-pin Terminal Block
          External FAN Connector1x External FAN Connector, 4-pin Terminal Block
          StorageSSD/HDD2x 2.5" SATA HDD/SSD bay (Gen3)
          One Internal, One Front Accessable
          Support RAID 0/1, Hot Swap
          mSATA3x mSATA (Shared by Mini-PCIe Socket) (Gen3)
          ExpansionPCI/ PCIe2x PCI/PCIe Expansion slots
          Optional Riser Card
          .1x PCIex16, 1x PCIex1
          .2x PCIex8
          .1x PCIex16, 1x PCI
          .2x PCI
          CFM (Control Function Module) Interface1x CFM Interface for CFM Modules
          CMI (Combine Multiple I/O) Interface2x CMI Interface for CMI Modules
          Mini PCI Express3x Full-size Mini PCIe
          Supports Wireless & I/O Expansion
          Universal I/O Bracket3x Universal I/O Bracket
          SIM Socket1x SIM Socket
          Antenna Holes2x Antenna Holes
          OtherInstant RebootSupport 0.2sec
          Power Ignition SensingOptional Module
          .CFM with Delay Time Management and Selectable 12V/24V, Dip Switch
          SuperCapSuperCap integrated for CMOS Battery Maintenance-free Operation
          Watchdog TimerSoftware Programmable Supports 256 Levels System Reset
          Power RequirementPower TypeAT/ATX
          Power Input Voltage9~48VDC
          Connector3-pin Terminal Block
          Power AdapterOptional AC/DC Adapter
          .AC/DC 24V/5A, 120W
          .AC/DC 24V/9.2A, 220W
          PhysicalDimension (WxDxH)227 x 261 x 128 mm
          Weight Information5.7 kg
          Mechanical ConstructionExtruded Aluminum with Heavy Duty Metal
          MountingWall
          Unibody DesignYes
          Fanless DesignYes
          Jumper-less DesignYes
          ProtectionReverse Power Input ProtectionYes
          Over Voltage ProtectionProtection Range: 51~58V
          Protection Type: shut down operating voltage, re-power on at the preset level to recover
          Over Current Protection15A
          ESD Protection+/-8kV (air), +/-4kV (contact)
          Surge3.84 kV (impedance 12 ohm 1.2/50us waveform)
          Operating SystemWindows- 7th Generation Intel® CPU (Kaby Lake-S): Windows® 10
          - 6th Generation Intel® CPU (Skylake-S): Windows® 10/ 8.1/ 7
          LinuxSupports by project
          EnvironmentOperating Temperature7th Generation Intel® CPU (Kaby Lake-S)
          - 35W TDP CPU: -40°C to 50°C
          - 51W~65W TDP CPU: -40°C to 45°C
          6th Generation Intel® CPU (Skylake-S)
          - 35W TDP CPU: -40°C to 70°C
          - 51~65W TDP CPU: -40°C to 50°C
          (With extended temperature peripherals; Ambient with air flow; According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14)
          Storage Temperature-40°C to 85°C
          Relative Humidity70°C @ 95% RH (non-Condensing)
          ShockOperating, 50 Grms, Half-sine 11 ms Duration
          (w/ SSD, according to IEC60068-2-27)
          VibrationOperating, 5 Grms, 5-500 Hz, 3 Axes
          (w/ SSD, according to IEC60068-2-64)
          CertificationEMCCE, FCC Class A, EN50121-3-2, E-Mark (E13, No. 10R-0514229)
          SafetyLVD EN62368-1


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