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免費(fèi)會員DS-1201強(qiáng)固型嵌入式電腦
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產(chǎn)品簡介
產(chǎn)品介紹
德承DS-1201是一款高性能的無風(fēng)扇嵌入式計算機(jī)，采用第9/8代Intel®Core™平臺(Coffee Lake-R/S)，提供多達(dá)8個核心來滿足各種計算需求。DS-1201提供豐富的I/O，如1個PS/2、1個音頻輸入輸出、2個RS-232/422/485串口、2個Intel® GbE網(wǎng)口、2個USB 3.1 (Gen2)、4個USB 3.0、2個USB 2.0并具備三重獨(dú)立顯示。在內(nèi)存和存儲方面，DS-1201可配備多達(dá)32GB的DDR4-2666 SO-DIMM內(nèi)存，2個2.5寸SATA III硬盤，3個mSATA SSD和1個M.2 2280 NVMe SSD，滿足高性能存儲需求。
基于德承*的CMI和CFM技術(shù)，可通過多網(wǎng)口（RJ45/M12）、網(wǎng)口供電（POE）、串口、光學(xué)隔離數(shù)字I/O和智能點(diǎn)火控制功能等隨時可用的模塊擴(kuò)展I/O和功能，用戶可使用各種現(xiàn)成的模塊根據(jù)自己的具體需求來配置系統(tǒng)。此外，DS-1201具有一個PCI(e)擴(kuò)展槽，可安裝多功能擴(kuò)展卡。具有寬工作溫度(-40°C ~ 70°C)，寬壓直流電源輸入(9V ~ 48V)，防震抗沖擊能力強(qiáng)（5G/50G），高標(biāo)準(zhǔn)的工業(yè)保護(hù)（OVP、OCP、ESD）等特點(diǎn)。DS-1201設(shè)計用于在惡劣條件下運(yùn)行，通過 EN50121-3-2和EN60950-1等嚴(yán)格的測試，可滿足各種車載應(yīng)用。
基于德承*的CMI和CFM技術(shù)，可通過多網(wǎng)口（RJ45/M12）、網(wǎng)口供電（POE）、串口、光學(xué)隔離數(shù)字I/O和智能點(diǎn)火控制功能等隨時可用的模塊擴(kuò)展I/O和功能，用戶可使用各種現(xiàn)成的模塊根據(jù)自己的具體需求來配置系統(tǒng)。此外，DS-1201具有一個PCI(e)擴(kuò)展槽，可安裝多功能擴(kuò)展卡。具有寬工作溫度(-40°C ~ 70°C)，寬壓直流電源輸入(9V ~ 48V)，防震抗沖擊能力強(qiáng)（5G/50G），高標(biāo)準(zhǔn)的工業(yè)保護(hù)（OVP、OCP、ESD）等特點(diǎn)。DS-1201設(shè)計用于在惡劣條件下運(yùn)行，通過 EN50121-3-2和EN60950-1等嚴(yán)格的測試，可滿足各種車載應(yīng)用。
詳細(xì)規(guī)格
| Model Name | DS-1201 | |
|---|---|---|
| System | Processor | ? 9th Generation Intel® Coffee Lake-R S Series CPU: - Intel® Core™ i7-9700E 8 Cores Up to 4.4 GHz, TDP 65W - Intel® Core™ i5-9500E 6 Cores Up to 4.2 GHz, TDP 65W - Intel® Core™ i3-9100E 4 Cores Up to 3.7 GHz, TDP 65W - Intel® Core™ i7-9700TE 8 Cores Up to 3.8 GHz, TDP 35W - Intel® Core™ i5-9500TE 6 Cores Up to 3.6 GHz, TDP 35W - Intel® Core™ i3-9100TE 4 Cores Up to 3.2 GHz, TDP 35W ? 8th Generation Intel® Coffee Lake S Series CPU: - Intel® Core™ i7-8700 6 Cores Up to 4.6 GHz - 12M Cache, TDP 65W - Intel® Core™ i5-8500 6 Cores Up to 4.1 GHz - 9M Cache, TDP 65W - Intel® Core™ i3-8100 4 Cores 3.6 GHz - 6M Cache, TDP 65W - Intel® Core™ i7-8700T 6 Cores Up to 4.0 GHz - 12M Cache, TDP 35W - Intel® Core™ i5-8500T 6 Cores Up to 3.5 GHz - 9M Cache, TDP 35W - Intel® Core™ i3-8100T 4 Cores 3.1 GHz - 6M Cache, TDP 35W - Intel® Pentium® G5400 2 Cores 3.7 GHz - 4M Cache, TDP 58W - Intel® Pentium® G5400T 2 Cores 3.1 GHz - 4M Cache, TDP 35W - Intel® Celeron® G4900 2 Cores 3.1 GHz - 2M Cache, TDP 54W - Intel® Celeron® G4900T 2 Cores 2.9 GHz - 2M Cache, TDP 35W |
| Chipset | Intel Q370 | |
| Memory | 2x DDR4-2400/2666 MHz SO-DIMM Sockets, Supports up to 64 GB (Un-buffered and Non-ECC Type) | |
| Graphics | ? Integrated Intel® UHD Graphics 630: Core™ i7/i5/i3 ? Integrated Intel® UHD Graphics 610: Pentium® /Celeron® ? Supports Triple Independent Display (1x DVI-I, 2x DisplayPort) | |
| Audio | Realtek® ALC888, High Definition Audio | |
| BIOS | AMI 32MB SPI BIOS | |
| I/O Interface | DVI | 1x DVI-I (DVI-D: 1920 x 1200 @60Hz / VGA: 1920 x 1080 @60Hz) |
| DP | 2x DisplayPort (DisplayPort: 4096 x 2304 @60Hz) | |
| LAN | 2x GbE LAN (Supports WoL, Teaming, Jumbo Frame & PXE), RJ45 - GbE1: Intel® I210 - GbE2: Intel® I219-LM Optional CMI Module - 4x RJ45 GbE LAN Module - 4x M12 GbE LAN Module | |
| PoE+ | Optional CMI & CFM Module - 4x PoE+, Individual port 25.5W, RJ45 Port - 4x PoE+, Individual port 25.5W, M12 Port | |
| Serial Port | 2x RS-232/422/485, DB9 Optional CMI Module - 4x Isolated COM Module - 4x COM Module * Supports RS-232/422/485 with Auto Flow Control, 5V/12V, DB9 | |
| USB | 2x USB 3.1 Gen2 (Type A) 4x USB 3.0 (Type A) 2x USB 2.0 (Type A) | |
| PS/2 Port | 1x PS/2, 6-pin mini-DIN Female Connector | |
| Isolated DIO | Optional CMI Module - 16x Optical Isolated DIO Module (8 in/8 out) | |
| Line-Out | 1x Line-Out, Phone Jack 3.5mm | |
| Mic-In | 1x Mic-In, Phone Jack 3.5mm | |
| Power Button | 1x ATX Power On/Off Button | |
| AT/ATX Switch | 1x AT/ATX Mode Switch | |
| Clear CMOS Switch | 1x Clear CMOS Switch | |
| Remote Power On/Off Connector | 1x Remote Power On/Off Connector, 2-pin Terminal Block | |
| Remote Reset Connector | 1x Remote Reset Connector, 2-pin Terminal Block | |
| External FAN Connector | 1x External FAN Connector, 4-pin Terminal Block | |
| Storage | SSD/HDD | ? 2x 2.5" SATA HDD/SSD bay (Gen3), 1x Internal, 1x Front Accessable ? Supports RAID 0/1 |
| M.2 | 1x M.2 Key M 2280 Socket, Supports PCIe x4 NVMe SSD or SATA SSD (Gen3) | |
| mSATA | 3x mSATA (shared by Mini-PCIe socket) (Gen3), BIOS Selectable | |
| Expansion | PCI/ PCIe | 1x PCI/PCIe Expansion slot (with Optional Riser Card) * Supports maximum dimensions of add-on card (H x L) : 110 x 237 mm |
| CFM (Control Function Module) Interface | 1x CFM (Control Function Module) Interface | |
| CMI (Combine Multiple I/O) Interface | 2x CMI (Combined Multiple I/O) High Speed Interface 2x CMI (Combined Multiple I/O) Low Speed Interface | |
| Mini PCI Express | 3x Full-size Mini-PCIe Socket | |
| Universal I/O Bracket | 4x Universal I/O Bracket | |
| SIM Socket | 2x SIM Socket | |
| Antenna Holes | 2x Antenna Holes | |
| Other | Instant Reboot | Support 0.2sec |
| Super Cap | SuperCap Integrated for CMOS Battery Maintenance-free Operation | |
| Watchdog Timer | Software Programmable Supports 256 Levels System Reset | |
| Power Requirement | Power Type | AT/ATX |
| Power Input Voltage | 9~48VDC | |
| Connector | 3-pin Terminal Block | |
| Power Adapter | Optional AC/DC Adapter - AC/DC 24V/5A, 120W - AC/DC 24V/9.2A, 220W | |
| Physical | Dimension (WxDxH) | 227 x 261 x 108 mm |
| Weight Information | 4.92 kg | |
| Mechanical Construction | Extruded Aluminum with Heavy Duty Metal | |
| Mounting | Wall | |
| Unibody Design | Yes | |
| Fanless Design | Yes | |
| Jumper-less Design | Yes | |
| Protection | Reverse Power Input Protection | Yes |
| Over Voltage Protection | Protection Range: 51~58V Protection Type: shut down operating voltage, re-power on at the preset level to recover | |
| Over Current Protection | 15A | |
| ESD Protection | +/-8kV (air), +/-4kV (contact) | |
| Surge | 3.84 kV (impedance 12 ohm 1.2/50us waveform) | |
| Operating System | Windows | Windows® 10 |
| Linux | Supports by project | |
| Environment | Operating Temperature | ? 35W TDP Processor: -40°C to 70°C ? 51~65W TDP Processor: -40°C to 45°C * PassMark BurnInTest: 99% CPU, 2D/3D Graphics (without thermal throttling) * With extended temperature peripherals; Ambient with air flow * According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14 |
| Storage Temperature | -40°C to 85°C | |
| Relative Humidity | 95%RH @ 70°C (non-Condensing) | |
| Shock | Operating, 50 Grms, Half-sine 11 ms Duration (w/ SSD, according to IEC60068-2-27) | |
| Vibration | Operating, 5 Grms, 5-500 Hz, 3 Axes (w/ SSD, according to IEC60068-2-64) | |
| MTBF | 396,565 Hours | |
| Certification | EMC | CE, FCC Class A, EN50121-3-2 |
| Safety | LVD EN62368-1 | |
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