￥面議
德承（深圳）科技有限公司
免費會員DS-1101強固型嵌入式電腦
| 參考價: | 面議 |
具體成交價以合同協(xié)議為準- 產(chǎn)品型號
- 品牌
- 生產(chǎn)商 廠商性質(zhì)
- 所在地
訪問次數(shù)：366更新時間：2021-12-11 10:02:38
聯(lián)系我們時請說明是智能制造網(wǎng)上看到的信息，謝謝!
產(chǎn)品簡介
產(chǎn)品介紹
德承DS-1101是一款高性能的無風扇嵌入式計算機，采用7/6代Intel®Core™平臺，支持多種臺式機CPU（LGA1151） ，支持兩個DDR4內(nèi)存插槽，可達64GB，使DS-1101能夠滿足各種計算需求。DS-1101具有豐富的I/O接口、串口供電、電隔離串口、光隔離數(shù)字I/O、多網(wǎng)口、網(wǎng)口供電（POE）、M12接口、RAID 0/1、智能點火控制和0.2秒即時重啟等功能。
由于德承的CMI和CFM技術，您可根據(jù)具體需要使用我們現(xiàn)成的模塊配置專屬的DS-1101。此外，還支持1個PCI/PCIe擴展槽，具有不同的接口組合，用于擴展各種應用的擴展卡。DS-1101是一款堅固耐用的嵌入式系統(tǒng)，具有寬工作溫度(-40°C ~ 70°C)，寬壓直流電源輸入(9V ~ 48V)，防震抗沖擊能力強（5G/50G），高標準的工業(yè)保護，具有超級電容可免維護長效運行等特點。DS-1101適用于惡劣環(huán)境和關鍵應用場合的部署，無需現(xiàn)場人員的維護。
由于德承的CMI和CFM技術，您可根據(jù)具體需要使用我們現(xiàn)成的模塊配置專屬的DS-1101。此外，還支持1個PCI/PCIe擴展槽，具有不同的接口組合，用于擴展各種應用的擴展卡。DS-1101是一款堅固耐用的嵌入式系統(tǒng)，具有寬工作溫度(-40°C ~ 70°C)，寬壓直流電源輸入(9V ~ 48V)，防震抗沖擊能力強（5G/50G），高標準的工業(yè)保護，具有超級電容可免維護長效運行等特點。DS-1101適用于惡劣環(huán)境和關鍵應用場合的部署，無需現(xiàn)場人員的維護。
詳細規(guī)格
| Model Name | DS-1101 | |
|---|---|---|
| System | Processor | ? 7th Generation Intel® CPU (Kaby Lake-S) - Intel® Core™ i7-7700T Processor (8M Cache, up to 3.8 GHz, 35W TDP) - Intel® Core™ i5-7500T Processor (6M Cache, up to 3.30 GHz, 35W TDP) - Intel® Core™ i3-7101TE Processor (3M Cache, 3.40 GHz, 35W TDP) - Intel® Celeron® G3930TE Processor (2M Cache, 2.70 GHz, 35W TDP) - Intel® Core™ i7-7700 Processor (8M Cache, up to 4.20 GHz, 65W TDP) - Intel® Core™ i5-7500 Processor (6M Cache, up to 3.80 GHz, 65W TDP) - Intel® Celeron® G3930E Processor (2M Cache, 2.90 GHz, 54W TDP) ? 6th Generation Intel® CPU (Skylake-S) - Intel® Core™ i7-6700TE Processor (8M Cache, up to 3.40 GHz, 35W TDP) - Intel® Core™ i5-6500TE Processor (6M Cache, up to 3.30 GHz, 35W TDP) - Intel® Core™ i3-6100TE Processor (4M Cache, 2.70 GHz, 35W TDP) - Intel® Pentium® Processor G4400TE (3M Cache, 2.40 GHz, 35W TDP) - Intel® Celeron® Processor G3900TE (2M Cache, 2.30 GHz, 35W TDP) - Intel® Core™ i7-6700 Processor (8M Cache, up to 4.00 GHz, 65W TDP) - Intel® Core™ i5-6500 Processor (6M Cache, up to 3.60 GHz, 65W TDP) - Intel® Core™ i3-6100 Processor (3M Cache, 3.70 GHz, 51W TDP) - Intel® Pentium® Processor G4400 (3M Cache, 3.30 GHz, 54W TDP) - Intel® Celeron® Processor G3900 (2M Cache, 2.80 GHz, 51W TDP) |
| Chipset | Intel Q170 | |
| Memory | 2x DDR4 2133 MHz SO-DIMM, Up to 64 GB (Un-buffered and Non-ECC) | |
| Graphics | ．Integrated Intel® HD Graphics ．Three Independent Display | |
| Audio | Realtek ALC888-GR, High Definition Audio | |
| BIOS | AMI 16 Mbit SPI BIOS | |
| I/O Interface | DVI | 1x DVI-I connector, Up to 1920x1080@60Hz |
| DP | 2x DP connector, Up to 3840 x 2160 | |
| LAN | ||
| 2x 10/100/1000 Mbps, RJ45 GbE1: Intel I219-LM GbE2: Intel I210 Support Wake On Lan, Teaming, Jumbo frame, IEEE 1588v2, PXE Optional Module ．4x 10/100/1000 Mbps, RJ45 Port ．4x 10/100/1000 Mbps, M12 Port | ||
| PoE+ | Optional Module ．4x PoE+, Individual port 25.5W, RJ45 Port ．4x PoE+, Individual port 25.5W, M12 Port | |
| Serial Port | 2x RS-232/422/485 with Auto Flow Control Support 5V/12V, DB9 Optional Module ．4x RS-232/422/485, DB9 Connector ．4x Electrical Isolated RS-232/422/485, DB9 Connector | |
| USB | ．6x USB 3.0, Type-A ．2x USB 2.0, Type-A | |
| PS/2 Port | 1x PS/2, 6-pin mini-DIN Female Connector | |
| Isolated DIO | Optional Module ．8x Optical Isolated DIO(4DI, 4DO), 10 pin Terminal Block | |
| Line-Out | 1x Line-Out, Phone Jack 3.5mm | |
| Mic-In | 1x Mic-In, Phone Jack 3.5mm | |
| Power Button | 1x ATX Power On/Off Button | |
| AT/ATX Switch | 1x AT/ATX Mode Switch | |
| Clear CMOS Switch | 1x Clear CMOS Switch | |
| Remote Power On/Off Connector | 1x Remote Power On/Off Connector, 2-pin Terminal Block | |
| Remote Reset Connector | 1x Remote Reset Connector, 2-pin Terminal Block | |
| External FAN Connector | 1x External FAN Connector, 4-pin Terminal Block | |
| Storage | SSD/HDD | 2x 2.5" SATA HDD/SSD bay (Gen3) One Internal, One Front Accessable Support RAID 0/1, Hot Swap |
| mSATA | 3x mSATA (Shared by Mini-PCIe Socket) (Gen3) | |
| Expansion | PCI/ PCIe | 1x PCI/PCIe Expansion slot Optional Riser Card ．1x PCIex16 ．1x PCI |
| CFM (Control Function Module) Interface | 1x CFM Interface for CFM Modules | |
| CMI (Combine Multiple I/O) Interface | 2x CMI Interface for CMI Modules | |
| Mini PCI Express | 3x Full-size Mini PCIe Supports Wireless & I/O Expansion | |
| Universal I/O Bracket | 2x Universal I/O Bracket | |
| SIM Socket | 1x SIM Socket | |
| Antenna Holes | 2x Antenna Holes | |
| Other | Instant Reboot | Support 0.2sec |
| Power Ignition Sensing | Optional Module ．CFM with Delay Time Management and Selectable 12V/24V, Dip Switch | |
| SuperCap | SuperCap integrated for CMOS Battery Maintenance-free Operation | |
| Watchdog Timer | Software Programmable Supports 256 Levels System Reset | |
| Power Requirement | Power Type | AT/ATX |
| Power Input Voltage | 9~48VDC | |
| Connector | 3-pin Terminal Block | |
| Power Adapter | Optional AC/DC Adapter ．AC/DC 24V/5A, 120W ．AC/DC 24V/9.2A, 220W | |
| Physical | Dimension (WxDxH) | 227 x 261 x 108 mm |
| Weight Information | 5.22 kg | |
| Mechanical Construction | Extruded Aluminum with Heavy Duty Metal | |
| Mounting | Wall | |
| Unibody Design | Yes | |
| Fanless Design | Yes | |
| Jumper-less Design | Yes | |
| Protection | Reverse Power Input Protection | Yes |
| Over Voltage Protection | Protection Range: 51~58V Protection Type: shut down operating voltage, re-power on at the preset level to recover | |
| Over Current Protection | 15A | |
| ESD Protection | +/-8kV (air), +/-4kV (contact) | |
| Surge | 3.84 kV (impedance 12 ohm 1.2/50us waveform) | |
| Operating Stystem | Windows | - 7th Generation Intel® CPU (Kaby Lake-S): Windows® 10 - 6th Generation Intel® CPU (Skylake-S): Windows® 10/ 8.1/ 7 |
| Linux | Supports by project | |
| Environment | Operating Temperature | 7th Generation Intel® CPU (Kaby Lake-S) - 35W TDP CPU: -40°C to 50°C - 51W~65W TDP CPU: -40°C to 45°C 6th Generation Intel® CPU (Skylake-S) - 35W TDP CPU: -40°C to 70°C - 51~65W TDP CPU: -40°C to 50°C (With extended temperature peripherals; Ambient with air flow; According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14) |
| Storage Temperature | -40°C to 85°C | |
| Relative Humidity | 70°C @ 95% RH (non-Condensing) | |
| Shock | Operating, 50 Grms, Half-sine 11 ms Duration (w/ SSD, according to IEC60068-2-27) | |
| Vibration | Operating, 5 Grms, 5-500 Hz, 3 Axes (w/ SSD, according to IEC60068-2-64) | |
| Certification | EMC | CE, FCC Class A, EN50121-3-2, E-Mark (E13, No. 10R-0514229) |
| Safety | LVD EN62368-1 | |
相關產(chǎn)品
-
-
￥面議 -
￥面議 -
￥面議
