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          eBOX671-521-FL

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          更新時(shí)間:2022-01-17 15:57:00瀏覽次數(shù):301次

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          產(chǎn)品特點(diǎn)9th/8thgenIntelCore™i7/i5/i3withIntelQ370chipset(CoffeeLake/CoffeeLakeRefresh-S)4-CHPoE(IEEE802

          產(chǎn)品特點(diǎn)

          • 9th/8th gen Intel® Core™ i7/i5/i3 & Celeron® with Intel® Q370 chipset (Coffee Lake/Coffee Lake Refresh-S)
          • 4-CH PoE (IEEE802.3at compliance)
          • Dual swappable 2.5" SATA HDD drive bays with RAID 0 &1
          • Supports MXM 3.1 type A graphics module (optional)
          • DVI-I, HDMI, and DisplayPort with triple-view supported
          • AMS.AXView intelligent remote monitoring software for IIoT

          產(chǎn)品介紹

          The eBOX671-521-FL is a GPU computing embedded system that comes with 4-CH PoE and MXM 3.1 Type A slot for applications in machine vision, edge computing, traffic vision, deep learning, and artificial intelligence of things. The outstanding eBOX671-521-FL with enhanced GPU computing performance is powered by the 9th/8th gen Intel® Core™ i7/i5/i3 processor with up to six-core, Intel® Pentium® processor, or Intel® Celeron® processor and comes with Intel® Q370 or optional Intel® C246 chipset. The fanless embedded GPU-based system is equipped with dual DDR4 ECC/non-ECC SO-DIMM slots for up to 64GB of system memory. The embedded vision system has an optional MXM type A slot for NVIDIA GTX1030 and GTX1050 graphics modules to enhance the performance of the visual display. Furthermore, this Intel® Coffee Lake-based embedded box PC is specially designed with four Gigabit 802.3at (PoE, Power-over-Ethernet) compliant Ethernet ports with a total power budget of 60W, six USB 3.1 ports and two Gigabit LANs to connect different devices or sensors. It comes in great expansion possibilities, including one internal MXM 3.1 type A connector, two full-size PCI Express Mini Card slots and two SIM slots. For storage, it has two swappable SATA HDD drive bays with a height of up to 9.5 mm and one mSATA for RAID 0 and 1 feature. Besides, we have designed a flexible I/O window slot for incorporating application-oriented I/O functions to meet the requirements of various cases. This embedded vision computer can be mounted using wall or DIN-rail mounting for versatile use in various environments.

          CPU
          • LGA1151 9th gen Intel® Core™ i7/i5/i3 & Celeron® processors (35W)
          • LGA1151 8th gen Intel® Core™ i7/i5/i3 & Celeron® processors (35W/65W)
          Chipset
          • Intel® Q370
          • Intel® C246 (optional)
          System Memory
          • 2 x 260-pin DDR4-2666 SO-DIMM, up to 64GB (ECC supported by Intel® C246 PCH)
          BIOS
          • AMI
          COM
          • 2 x RS-232/422/485
          USB
          • 4 x USB 3.1 Gen2
          • 2 x USB 3.1 Gen1
          Ethernet/PoE
          • 2 x 10/100/1000 Mbps (Intel® i210-IT & i219-LM)
          • 4 x Power over Ethernet (IEEE802.2at), up to 60W
          Display
          • 2 x DisplayPort via optional MXM kit
          • 1 x HDMI
          • 1 x DisplayPort
          • 1 x DVI-I
          Digital I/O
          • N/A
          Audio
          • N/A
          Storage
          • 2 x 2.5" HDD drive bay (max. up 9.5 mm height)
          • 1 x mSATA (enabled in BIOS setting)
          Expansion
          • 2 x Full-size PCI Express Mini Card slot (USB + PCIe signal)
          • 2 x SIM slot
          • 1 x MXM3.1 type A connector
          Others
          • 1 x Flexible I/O window (Default : 2 x DB9 half cut bracket)
          • 4 x SMA-type antenna connector
          • TPM 2.0
          Power
          • 24 VDC
          Watchdog Timer
          • 255 levels, 1 to 255 sec.
          Construction
          • Aluminum extrusion and heavy-duty steel, IP40
          Operating Temperature
          • Without MXM module:
            -40°C to +60°C (-40°F to +140°F) (with W.T. DRAM & SSD, CPU TDP 35W)
            -40°C to +50°C (-40°F to +122°F) (with W.T. DRAM & SSD, CPU TDP 65W)
          • With MXM module:
            -40°C to +50°C (-40°F to +122°F) (with W.T. DRAM & SSD & MXM Kit, CPU TDP 35W)
          Relative Humidity
          • 10% to 90%, non-condensing
          Vibration
          • IEC 60068-2-64 (w/ SSD: 3Grms STD, random, 5 - 500 Hz, 1 hr/axis)
          Shock
          • IEC 60068-2-27 (w/ SSD: 50G, half-sine, 11 ms duration)
          Dimensions
          (W x D x H)
          • 280 x 210 x 80.5 mm (11.02" x 8.26" x 3.16")
          Weight (net/gross)
          • 4.8 kg (10.58 lb)/5.6 kg (12.34 lb)
          Certifications
          • CE, FCC Class A
          EOS Support
          • Win 10 IoT, Linux
          Software Support
          • AMS.AXView
          Mounting
          • Wall mount kit
          • DIN-rail kit

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