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IPC970嵌入式系統(tǒng)與網(wǎng)絡(luò)安全平臺(tái)

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產(chǎn)品特點(diǎn)IntelXeonand10thGenIntelCore™i7/i5/i3processors,upto80WIntelW480EchipsetNVIDIARTX3090GPUcardSupportsM

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產(chǎn)品特點(diǎn)

Intel® Xeon® and 10th Gen Intel® Core™ i7/i5/i3 processors, up to 80W
Intel® W480E chipset
NVIDIA® RTX3090 GPU card
Supports M.2 Key B slot for 5G wireless connection
Supports M.2 Key E slot for Wi-Fi connection
Supports RAID 0,1
Supports power-on delay function
Supports TPM 2.0

產(chǎn)品介紹

The IPC970 is powered by the Intel® Xeon® or 10th generation Intel® Core™ i7/i5/i3 processors with the Intel® W480E chipset. The powerful edge computing system supports NVIDIA® GeForce RTX™ 3090 graphics card with 10,496 CUDA cores and a whopping 24GB of GDDR6X memory for powerful GPU computing capability. The ruggedized IPC970 provides flexible expansion options with one I/O module slot and three PCIe slots plus one blank expansion slot. In addition, it has a full-size PCIe Mini Card slot for Wi-Fi/Bluetooth/LTE modules, one M.2 Key B 3042/3050 socket for 5G wireless connections, and one M.2 Key E 2230 socket for Wi-Fi/Bluetooth modules. Its front-facing I/O design makes it easy to access and deploy. To ensure stable and reliable operation in harsh industrial environments, the IPC970 has a wide operating temperature range of -10°C to +70°C and a power input of 24V DC (uMin=19V/uMax=30V) with power-on delay function, over-voltage protection, over current protection, and reverse voltage protection.

CPU	Intel® Xeon® and 10th Gen Intel® Core™ i7/i5/i3 processors (Cometlake-S), up to 80W
Chipset	Intel® W480E
System Memory	4 x DDR4-2933 MT/s ECC or non-ECC U-DIMM socket, up to 128GB
BIOS	AMI
COM	Available from extension I/O modules
USB	6 x USB 3.2 Gen2 (10G) 2 x USB 3.2 Gen1 1 x USB 2.0 (internal, 180D type A for license key) More USB ports available from extension I/O modules
Ethernet	1 x 2.5 Gigabit LAN (Intel® i225-LM) 1 x 1 Gigabit LAN (Intel® i211-AT) More LAN ports available from extension I/O modules
Display	1 x VGA 1920 x 1200 resolution 1 x HDMI 4096 x 2304 @30Hz
Digital I/O	Available from extension I/O modules
Audio	1 x Line-out
Storage	2 x SSD/HDD drive bay (7/9.5mm height, external) 1 x SSD/HDD drive bay (optional, 7/9.5/15mm height, internal) (supports RAID 0,1) 1 x M.2 Key M 2280 socket (PCIe Gen3 x4) for NVMe SSD
Expansion	2 x PCIe x8 (x4 signal) slot 1 x PCIe x16 slot 1 x Full-size PCI Express Mini Card slot with SIM slot (USB & PCIe interface) 1 x M.2 Key E 2230 socket 1 x M.2 Key B 3042/3050 socket with SIM slot
Others	TPM 2.0
Power	Type: ATX/AT Input: 24 VDC (uMin=19V/uMax=30V)
Construction	Aluminum extrusion heavy-duty cold-rolled steel
Operating Temperature	-10°C to +70°C (+14°F up to +149°F) with W.T. HDD/SSD
Relative Humidity	10% to 90%, non-condensing
Dimensions (W x H x D)	190 x 192 x 360 mm (7.48" x 7.55" x 14.17") (D) CE
Weight (net/gross)	9.8 kg/7.3 kg
Software Support	AXView
EOS Support	Windows® 10, Linux
Certifications	CE