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GM-1000嵌入式MXM GPU電腦 (GM-1000)
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產(chǎn)品介紹
德承的強固緊湊型GPU運算系統(tǒng)GM-1000系列，可支持嵌入式MXM GPU模塊的擴展。這款高性能GPU運算系統(tǒng)可滿足現(xiàn)場端需要的高運算能力，同時易于安裝于任何工業(yè)現(xiàn)場以及空間有限制的環(huán)境，非常適用于生產(chǎn)型工業(yè)機器人、機器視覺、圖像識別分析、人工智能和無人駕駛等應用。
GM-1000可配置第9 /8代Intel®處理器，包括Xeon®和Core™i系列，達到8核。它支持64GB雙通道的DDR4 2666MHz SO-DIMM內(nèi)存。包含豐富的I / O，含4個COM、2個GbE LAN、8個USB、1個HDMI和1個DVI-I。GM-1000配備M.2 M key插槽可支持NVMe SSD，同時也配備M.2 E key插槽可支持CNVi的Wi-Fi藍牙連接，來滿足高速數(shù)據(jù)存儲和通信的要求。它的尺寸僅有W260x D200x H85(mm)，使它易于安裝在狹小的工業(yè)現(xiàn)場環(huán)境。
GM-1000設計的系統(tǒng)功耗高達360W，可滿足CPU和GPU同時運行所需的高功耗。MXM 3.1 Type A / B擴展模塊可實現(xiàn)額外的GPU運算加速，兼容來自各GPU品牌制造商的嵌入式GPU模塊，功耗可達160W。高功耗/高運算環(huán)境下會產(chǎn)生的大量熱能，GM-1000采用了*的散熱設計，包括CPU和GPU的獨立冷卻系統(tǒng)、爬墻式銅導管、特殊的散熱型材。此外，GM-1000還帶有4個獨立風扇的外部風扇套件，用以產(chǎn)生空氣對流進行散熱降溫。
基于德承創(chuàng)新的CMI（IO擴展模塊）和CFM（控制功能模塊）技術(shù)，GM-1000可根據(jù)客戶的需求彈性擴展其他功能。GM-1000具備多個CMI接口，可安裝專屬的CMI模塊，例如2*10GbE LAN、4*RJ45 GbE LAN、4*M12 RJ45 GbE LAN、16*DIO、2*COM。而CFM接口可安裝專屬的CFM模塊，可依需求安裝POE+和IGN智能點火功能。
GM-1000可配置第9 /8代Intel®處理器，包括Xeon®和Core™i系列，達到8核。它支持64GB雙通道的DDR4 2666MHz SO-DIMM內(nèi)存。包含豐富的I / O，含4個COM、2個GbE LAN、8個USB、1個HDMI和1個DVI-I。GM-1000配備M.2 M key插槽可支持NVMe SSD，同時也配備M.2 E key插槽可支持CNVi的Wi-Fi藍牙連接，來滿足高速數(shù)據(jù)存儲和通信的要求。它的尺寸僅有W260x D200x H85(mm)，使它易于安裝在狹小的工業(yè)現(xiàn)場環(huán)境。
GM-1000設計的系統(tǒng)功耗高達360W，可滿足CPU和GPU同時運行所需的高功耗。MXM 3.1 Type A / B擴展模塊可實現(xiàn)額外的GPU運算加速，兼容來自各GPU品牌制造商的嵌入式GPU模塊，功耗可達160W。高功耗/高運算環(huán)境下會產(chǎn)生的大量熱能，GM-1000采用了*的散熱設計，包括CPU和GPU的獨立冷卻系統(tǒng)、爬墻式銅導管、特殊的散熱型材。此外，GM-1000還帶有4個獨立風扇的外部風扇套件，用以產(chǎn)生空氣對流進行散熱降溫。
基于德承創(chuàng)新的CMI（IO擴展模塊）和CFM（控制功能模塊）技術(shù)，GM-1000可根據(jù)客戶的需求彈性擴展其他功能。GM-1000具備多個CMI接口，可安裝專屬的CMI模塊，例如2*10GbE LAN、4*RJ45 GbE LAN、4*M12 RJ45 GbE LAN、16*DIO、2*COM。而CFM接口可安裝專屬的CFM模塊，可依需求安裝POE+和IGN智能點火功能。
詳細規(guī)格
| Model Name | GM-1000 | |
|---|---|---|
| System | Processor | ? 9th Generation Intel® Coffee Lake-R CPU: - Intel® Xeon® E-2278GE 8 Cores Up to 4.7 GHz, TDP 80W - Intel® Xeon® E-2278GEL 8 Cores Up to 3.9 GHz, TDP 35W - Intel® Core™ i7-9700E 8 Cores Up to 4.4 GHz, TDP 65W - Intel® Core™ i5-9500E 6 Cores Up to 4.2 GHz, TDP 65W - Intel® Core™ i3-9100E 4 Cores Up to 3.7 GHz, TDP 65W - Intel® Core™ i7-9700TE 8 Cores Up to 3.8 GHz, TDP 35W - Intel® Core™ i5-9500TE 6 Cores Up to 3.6 GHz, TDP 35W - Intel® Core™ i3-9100TE 4 Cores Up to 3.2 GHz, TDP 35W ? 8th Generation Intel® Coffee Lake CPU: - Intel® Xeon® E-2176G 6 Cores up to 4.7 GHz, TDP 80W - Intel® Xeon® E-2124G 4 Cores up to 4.5 GHz, TDP 71W - Intel® Core™ i7-8700 6 Cores up to 4.6 GHz, TDP 65W - Intel® Core™ i5-8500 6 Cores, up to 4.1 GHz, TDP 65W - Intel® Core™ i3-8100 4 Cores 3.6 GHz, TDP 65W - Intel® Core™ i7-8700T 6 Cores up to 4.0 GHz, TDP 35W - Intel® Core™ i5-8500T 6 Cores up to 3.5 GHz, TDP 35W - Intel® Core™ i3-8100T 4 Cores 3.1 GHz, TDP 35W - Intel® Pentium® G5400 2 Cores 3.7 GHz, TDP 58W - Intel® Pentium® G5400T 2 Cores 3.1 GHz, TDP 35W - Intel® Celeron® G4900 2 Cores 3.1 GHz, TDP 54W - Intel® Celeron® G4900T 2 Cores 2.9 GHz, TDP 35W |
| Chipset | Intel C246 | |
| Memory | ? 2x DDR4-2666/2400 MHz SO-DIMM Sockets ? Support up to 64 GB (Un-buffered and non-ECC type) * Xeon/i7/i5: Up to DDR4 2666MHz * i3/Pentium/Celeron: Up to DDR4 2400MHz | |
| Graphics | ? Integrated Intel® UHD Graphics (Xeon/i7/i5/i3: UHD 630; Pentium/Celeron: UHD 610) ? Supports Triple Independent Display (DVI-I/DisplayPort/HDMI) | |
| Audio | Realtek® ALC888, High Definition Audio | |
| BIOS | AMI BIOS | |
| I/O Interface | DVI | 1x DVI-I Connector (VGA: 1920 x1080 @ 60 Hz; DVI-D: 1920 x1200 @ 60Hz) |
| DP | 1x DisplayPort Connector (4096 x 2304 @ 60Hz) | |
| HDMI | 1x HDMI Connector (4096 x 2160 @ 30Hz) | |
| LAN | 2x GbE LAN Ports (Supports WoL, Teaming, Jumbo Frame & PXE), RJ45 - GbE1: Intel® I219-LM - GbE2: Intel® I210 | |
| Serial Port | 4x RS-232/422/485 Ports with Auto Flow Control (Support 5V/12V), DB9 | |
| USB | 4x 10Gbps USB3.2 Gen2 Ports, Type-A 4x 5Gbps USB3.2 Gen1 Ports, Type-A | |
| Line-Out | 1x Line-Out, Phone Jack 3.5mm | |
| Mic-In | 1x Mic-In, Phone Jack 3.5mm | |
| Power Button | 1x ATX Power On/Off Button | |
| AT/ATX Switch | 1x AT/ATX Mode Switch | |
| Rest Button | 1x Rest Button | |
| Clear CMOS Switch | 1x Clear CMOS Switch | |
| Remote Power On/Off Connector | 1x Remote Power On/Off Connector, 2-pin Terminal Block | |
| External FAN Connector | 2x External Fan Connectors, 4-pin Terminal Block (Supports Smart Fan by BIOS) | |
| Storage | SSD/HDD | 2x SATA III (6Gbps) Front Accessible 2.5" HDD/SSD Trays (up to 15mm in Height) |
| mSATA | 3x mSATA Socket (SATA 3.0, shared by Mini-PCIe socket) | |
| RAID | Supports S/W RAID 0, 1, 5 & 10 | |
| PCIe | 1x PCIe x4 M.2 Key M 2280 Socket, Supports NVMe SSD | |
| Expansion | MXM Socket | 1x MXM Carrier Board Interface for MXM GPU Module Expansion |
| CFM (Control Function Module) Interface | 1x CFM Interface for CFM Modules - CFM-IGN01: Ignition Sensing Function | |
| CMI (Combine Multiple I/O) Interface | 1x High Speed CMI Interface for I/O Expansion - CMI-10GLAN01 : 2x 10G Intel® X550 RJ45 LAN - CMI-LAN01 : 4x 1G Intel® I210 RJ45 LAN - CMI-M12LAN01 : 4x 1G Intel® I210 M12 LAN 1x Low Speed CMI Interface - CMI-COM01 : 2x RS232/422/485, Support 5V/12V - CMI-DIO01 : 16x DIO (8 in, 8 out) | |
| Mini PCI Express | 3x Full-size Mini-PCIe Sockets | |
| M.2 Socket | 1x M.2 2230 Socket (Key E), support Intel CNVi Module | |
| SIM Socket | 2x SIM Socket | |
| Antenna Holes | 2x Antenna Holes | |
| Other | Instant Reboot | Support 0.2sec |
| Power Ignition Sensing | Optional Module ．CFM with Delay Time Management and Selectable 12V/24V, Dip Switch | |
| Super Cap | SuperCap Integrated for CMOS Battery Maintenance-free Operation | |
| Watchdog Timer | Software Programmable Supports 256 Levels System Reset | |
| Power Requirement | Power Type | AT/ATX |
| Total Power Budget | 360W | |
| Power Input Voltage | 9-48 VDC, Single Power Source | |
| Connector | 2x 3-pin Terminal Block, Each Terminal Block Current Limitation is 15A Power input voltage from 9V to 23V must use dual power connectors, power input voltage from 24V to 48V can use single power connector | |
| Power Adapter | Optional AC/DC Adapter - AC/DC 24V Power Adapter, 220W | |
| Physical | Dimension (WxDxH) | 260 x 200 x 85 mm |
| Weight Information | 4.6 kg | |
| Mechanical Construction | Extruded Aluminum with Heavy Duty Metal | |
| Mounting | Wall / VESA / DIN Rail / Side | |
| Unibody Design | Yes | |
| Fanless Design | Yes | |
| Jumper-less Design | Yes | |
| Cable-less Design | Yes | |
| Protection | Reverse Power Input Protection | Yes |
| Over Voltage Protection | Protection Range: 51~58V Protection Type: shut down operating voltage, re-power on at the preset level to recover | |
| Over Current Protection | 30A | |
| ESD Protection | +/-8kV (air), +/-4kV (contact) | |
| Surge Protection | 3.84 kV (impedance 12 ohm 1.2/50us waveform) | |
| Operating System | Windows | Windows® 10 |
| Linux | Support by project | |
| Environment | Operating Temperature | - 35W CPU: -40°C - 70°C - 65W CPU + FAN: -40°C - 60°C - 80W CPU + FAN: -40°C - 55°C * PassMark BurnInTest: 99% CPU, 2D Graphics (without thermal throttling) * For GM-1000 + MXM GPU Module operating temperature, please refer to product datasheet * With extended temperature peripherals; Ambient with air flow * According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14 |
| Storage Temperature | -40°C to 85°C | |
| Relative Humidity | 95% RH @ 70°C (Non-condensing) | |
| Shock | Operating, 50 Grms, Half-sine 11 ms Duration * w/ SSD, according to IEC60068-2-27 | |
| Vibration | Operating, 5 Grms, 5-500 Hz, 3 Axes * w/ SSD, according to IEC60068-2-64 | |
| EMC | CE/FCC Class A, EN 50121-3-2, E-mark (E13 No. 10R-0615566) | |
| Safety | LVD (EN62368-1) | |
| MTBF | 331,596 Hours Database: Telcordia SR-332 Issue 3, Method 1, Case 3 | |
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