LGA1155英特爾®酷睿i7/酷睿i5/酷睿i3 SHB DDR3/ SATA2.0/單千兆以太網(wǎng)

研華嵌入式系統(tǒng)單板電腦| PICMG 1.3系統(tǒng)主機板PCE-5026

• LGA1155 In® Core™ i7/i5/i3, Pentium® and Celeron® processors
• Dual Channel (Non-ECC) DDR3 1066/1333/1600* up to 16 GB
• Supports 10 USB2.0 and TPM1.2(Optional)
• Supports embedded software APIs and utilities
• 研華嵌入式系統(tǒng)單板電腦| PICMG 1.3系統(tǒng)主機板PCE-5026

• 		PCE-5026VG-00A1E
  		Quote
  Form Factor	Form Factor	PICMG1.3
  Processor System	CPU	In Core i3/i5/i7
  	CPU TDP	Up to 95 W
  	Frequency	Up to 3.4 GHz
  	Core Number	4
  	L2 Cache	-
  	L3 Cache	8MB
  	BIOS	AMI 64 Mbit
  	Chipset	In H61
  	Integrated Graphics	Yes
  	FSB	-
  Memory	Technology	DDR3 1066/1333/1600 MHz
  	Capacity	Up to 16GB
  	ECC Support	-
  	Socket	1 x 240-pin DDR3
  Display	Controller	In HD graphics Integrated
  	Graphic Memory	Shared with system memory up to 1GB
  	Multiple Display	-
  	Display Interface	VGA: Up to 2048 x 1536
  Expansion Interface	PCI Express x 16	1
  	PCI Express x 4	1
  	PCI	4
  Ethernet	Controller	LAN1: In 82579V
  	Speed	10/100/1000 Mbps
  	Connector	2 x RJ45
  WatchDog Timer	Output	System Reset
  	Interval	Programmable 1~255 sec
  Storage	CFast	-
  	CompactFlash	-
  I/O	SATA	4 x SATA II
  	IDE	-
  	Floppy	-
  	USB2.0	-
  	USB3.0	10
  	GPIO	8-bit
  	LPT	1
  	COM Port	2 x RS232
  	PS/2 Keyboard/Mouse	1
  	System Fan	1
  Rear I/O Interface	USB2.0	-
  	COM	1 x RS232
  	PS/2	2 (1 x Keyboard, 1 x Mouse)
  	Ethernet	1
  	VGA	1
  Power Requirement	Voltage	+12 V/+5 V/+3.3 V/+5 VSB/-12 V/-5 V
  	Current	6.65A/1.62A/1.98A/0.73A/0.13A/0A
  Environment	Operational Temperature	0 ~ 60° C (32 ~ 140° F) (Operational humidity: 40° C @ 95% RH Non-Condensing)
  	Non-Operational Temperature	-40~ 85° C and 60° C @ 95% RH Non-Condensing
  	Non-Operating Vibration	2 Grms
  Physical Characteristics	Dimensions (LxW)	338 x 122 mm (13.3" x 4.8")
  	Weight	0.5 kg
  Certification	EMC	CE, FCC
  Management Solution	Out of band remote management	-

| PICMG 1.3系統(tǒng)主機板PCE-5026