CPU

Intel® Atom™ D2550 1.86GHz

主芯片

ICH10R

內(nèi)存

One 204-pin DDR3 1066MHz SO-DIMM slot (up to 4GB)

擴(kuò)展

1 x Mini-PCIe socket (PCIe + USB) for WLAN option

1 x Mini-PCIe socket (USB) for WWAN option

1 x Bluetooth module for option

1 x on board uBlox NEO-6Q GPS module or optional GPS with dead reckoning

前置I/O界面

1 x Line-out, 1 x Mic-in (for WWAN CM8000 voice communication)

2 x SIM card socket (selectable)

1 x System reset button

1 x USB 2.0 host type A connector

1 x Power button1 x CFast with protection cover

1 x Accessible 2.5" SATA II SSD tray

2 x DB9 isolation RS-422/ 485, Isolation: 5K Vrms

3 x DB9 isolation RS-232, Isolation: 5K Vrms

4 x LED’s for power, storage, WLAN/ WWAN and GPIO

G sensor

后置I/O界面

1 x 9~36VDC input with ignition and 29W typical power consumption

1 x 12V/4A DC output, SMBus

1 x DB26 LVDS interface with 12V and USB2.0

1 x DB9 RS-232 (default) or OBDII (option)

1 x DB9 RS-422/ 4851 x DB9 female connector for 4 x DI and 4 x DO
(Digital Input)
Input Voltage (Internal Type): 5VDC TTL (default)
Input Voltage (Source Type): 0~30 VDC
(Digital Output)
Digital Output (Sink Type): 5VDC TTL (default), max current: 20mA
Digital Output (Source Type): 0~30VDC, max current: 250mA10-Pin terminal block for 8 x DI and 8 x DO
Isolation: 5K Vrms
(Isolated Digital Input)
Input Voltage (Internal Type): 5VDC TTL (default)
Input Voltage (Source Type): 0~30 VDC
(Isolated Digital Output)
Digital Output (Sink Type): 5VDC TTL (default), max current: 20mA
Digital Output (Source Type): 0~30VDC, max current: 250mA

5-Pin terminal block for 3x analog input
Isolation: 2K Vrms
2 x isolated analog voltage input 12VDC (Max.)
1 x isolated analog current input 10A (Max.)

2 x USB 2.0 host type A connector

2 x RJ45 with LEDs for 10/ 100/ 1000Mbps Ethernet

1 x Line-out, 1 x Mic-in

電源管理

Selectable boot-up & shut-down voltage for low power protection by software

Setting 8-level on/off delay time by software

Status of ignition and low voltage status can be detected by software

Support S3/ S4 suspend mode

操作系統(tǒng)

WES 7

Win7 Pro for Embedded

Linux 2.6

WES 2009

尺寸

260mm (W) x 176mm (D) x 73.6mm (H) (10.24"x 6.93"x 2.9")

4 Kg (7.47 Lb)

構(gòu)造

Aluminum enclosure with fanless design

運(yùn)行環(huán)境

Operating temperatures:
-30°C to 55°C (w/ industrial SSD) with air flow
-20°C to 45°C (w/ commercial HDD) with air flow

Storage temperatures: -35°C to 85°C

elative humidity: 10% to 90% (non-condensing)

Vibration (random): 1g@5~500 Hz (in operation, SSD)Vibration (SSD):
Operating: MIL-STD-810G, Method 514.6, Category 4, common carrier US highway truck vibration exposure
Storage: MIL-STD-810G, Method 514.6, Category 24, minimum integrity test

Shock (SSD):
Operating: MIL-STD-810G, Method 516.6, Procedure I, functional shock=20g
Non-Operating: MIL-STD-810G, Method 516.6, Procedure V, crash hazard shock test=75g

標(biāo)準(zhǔn)/認(rèn)證

CE approval

FCC Class A

e13 Mark