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eBOX671B

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公司名稱艾訊科技（深圳）有限公司
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更新時(shí)間2023/7/11 14:30:20
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中國臺灣艾訊科技 (Axiomtek) 于 1990 年成立于中國臺灣，20余年來，已成為世界工業(yè)計(jì)算機(jī)領(lǐng)域*的*設(shè)計(jì)者和制造商。自公司初創(chuàng)立起，艾訊科技即以創(chuàng)新的設(shè)計(jì)、高質(zhì)量的質(zhì)量保證和高客戶滿意度的服務(wù)態(tài)度而*業(yè)界。

艾訊科技以創(chuàng)新的動(dòng)力跟積極的企業(yè)文化，成為工業(yè)計(jì)算機(jī)界的。今后將繼續(xù)秉持高質(zhì)量、高效率、高客戶滿意度的態(tài)度，提供更*的產(chǎn)品及優(yōu)質(zhì)的服務(wù)。

艾訊科技已在大陸、美國、歐洲等地建立了分公司和銷售機(jī)構(gòu)，直屬員工800多人。并在大陸和美國設(shè)立了工廠，以便更好服務(wù)當(dāng)?shù)乜蛻簟?/p>

艾訊科技為了滿足客戶的多樣化需求，在制造系統(tǒng)上投資大規(guī)模的較早制造設(shè)備，比如電磁兼容實(shí)驗(yàn)室等，以提供客戶高質(zhì)量產(chǎn)品、實(shí)時(shí)性的送貨服務(wù)及Z滿意的價(jià)格。目前，艾訊科技擁有14,000 平方米的廠房，制造設(shè)施通過 ISO-9001和ISO-14001的認(rèn)證。

我們引進(jìn)日本**SMT及光學(xué)檢測設(shè)備，并且導(dǎo)入無鉛制程。嚴(yán)格執(zhí)行生產(chǎn)管制及檢驗(yàn)并且提供數(shù)據(jù)統(tǒng)計(jì)及分析做為改善依據(jù)，落實(shí)品保循環(huán)。艾訊科技將持續(xù)不斷專注于生產(chǎn)技術(shù)的改良與創(chuàng)新，以提高產(chǎn)品生產(chǎn)效率及質(zhì)量

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工控機(jī)，嵌入式主板，平板電腦，工業(yè)交換機(jī)，嵌入式工控機(jī)，工業(yè)主板，觸摸屏，HMI,航海級平板電腦，多媒體

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產(chǎn)品特點(diǎn)13th/12thGenIntelCore™i9/i7/i5/i3andCeleronprocessorswithIntelR680Echipset(AlderLakeS)DualDDR5SO-DIMMforupto64GBofmemory4LANwithoptionalPoEsupportedDual2

eBOX671B 產(chǎn)品信息

產(chǎn)品特點(diǎn)

13th/12th Gen Intel® Core™ i9/i7/i5/i3 and Celeron® processors with Intel® R680E chipset (Alder Lake S)
Dual DDR5 SO-DIMM for up to 64GB of memory
4 LAN with optional PoE supported
Dual 2.5" SATA HDD drive bays with RAID 0 & 1
Supports MXM 3.1 Type A, up to 5 display outputs
-40 °C to +65 °C wide operating temperatures
Wide range power input from 9 to 36 VDC
Flexible I/O window supported via mPCIe modules

CPU	LGA1700 socket 13th/12th Gen Intel® Core™ i9/i7/i5/i3 & Celeron® processor (35W/65W)
Chipset	Intel® R680E
System Memory	2 x 262-pin DDR5-4800 SO-DIMM, up to 64GB
BIOS	AMI
COM	2 x RS-232/422/485 with autoflow 2 x RS-232
USB	2 x USB 3.2 Gen1 4 x USB 3.2 Gen2
Ethernet/PoE	3 x 2.5 GbE (Intel® i226-IT) 1 x GbE LAN (Intel® i219-LM) 4 PoE by request (PoE IEEE802.3at, up to 60W)
Display	2 x HDMI 1.4b (1 x lockable) 1 x DisplayPort 1.4a 2 x DisplayPort 1.4a via optional MXM kit
Digital I/O	N/A
Audio	1 x Audio (MIC-in/Line-out); by request
Storage	2 x 2.5" SATA HDD/SSD (up to 15 mm height; RAID 0,1 supported) 1 x NVMe by M.2 Key M 2280 1 x mSATA (enable in BIOS setting)
Expansion	1 x Full-size PCI Express Mini Card slot (USB 2.0 + PCIe + SIM + mSATA signal) 1 x M.2 Key M 2280 socket (for storage) 1 x M.2 Key E 2230 socket (for Wi-Fi 6E) 1 x M.2 Key B 3052 socket (for 5G) 1 x Internal SIM slot for PCIe Mini Card slot 1 x MXM3.1 type A connector 1 x Flexible IO window (Default: 2 x DB9 half-cut bracket)
Others	TPM 2.0 1 x Power button 1 x Remote switch 1 x Front access SIM slot with cover (for M.2 Key B) 1 x Reset switch connector 5 x Antenna opening 1 x Grounding screw
Power	9 to 36 VDC with ACC ignition 1 x Phoenix type VDC power input connector
Watchdog Timer	255 levels, 1 to 255 sec.
Construction	Aluminum extrusion and heavy-duty steel, IP40
Operating Temperature	Without MXM module: -40°C to +65°C (-40°F to +140°F) (with W.T. DRAM & SSD, CPU TDP 35W) -40°C to +55°C (-40°F to +122°F) (with W.T. DRAM & SSD, CPU TDP 65W) With MXM module: -40°C to +55°C (-40°F to +122°F) (with W.T. DRAM & SSD & MXM kit, CPU TDP 35W)
Relative Humidity	10% - 90%, non-condensing
Vibration	IEC 60068-2-64 (w/ SSD: 3Grms STD, random, 5 - 500 Hz, 1 hr/axis)
Shock	IEC 60068-2-27 (w/ SSD: 50G, half-sine, 11 ms duration)
Dimensions (W x D x H)	280 mm (11.02") (W) x 210 mm (8.26") (D) x 80.5 mm (3.16") (H)
Weight (net/gross)	4.9 kg (10.8 lb)/7 kg (15.43 lb)
Certifications	CE, FCC Class A, UKCA
EOS Support	Win 10 IoT, Win 11 IoT, Linux
Software Support	N/A
Mounting	Wall mount kit DIN-rail kit